Application system:

Apply to Assembly, Other Adhesives, Selalants

Gunnability, Slump resistance, Temperature resistance ,APEO Free, Heavy Metal Free, Solvent Free, Not intentionally added but not specifically

measured (not part of product specification）

Features:

PAMID D680 is a high performance micronised amide wax rheology modifier designed for the high temperature manufacture of moisture curing methoxysilanes systems, where processing temperatures typically lie within the range

90-115℃.PAMID D680 particles are converted to an interacting network of crystalline fibres. It is this network that gives rise to the shear thinning rheology. This shear thinning characteristic provides for a low viscosity at the shear rates associated with application by extrusion, and a very high viscosity under the low shear rates experienced after application. The net result is ease of application followed by excellent sag and slump resistance.

Specific performance:

1. Easy handling
2. Antisettling.
3. In-can appearence
4. Syneresis resistance
5. Viscosity stability

Physical properties:

Nature: Polyamide

Appearance:Off-white micronized powder

Solid Content (%):100

Active Content (%)：100

Specific gravity：0.99

Particle size distribution：DV.1 min: 1.8 μm / DV.9 max: 15.0 μm

Bulk density：0.4-0.6

Melting Point(℃)：125

Bio content (%)：93

Recommended addition level:  

1-5% under heat and shear

How to use:

The successful manufacture of methoxysilane based sealants is very dependent

on the careful control of moisture levels throughout manufacture and storage.

For this reason it is normal practice to pre-dry all pigments and extenders prior

to dispersion with the methoxysilane polymer. Alternatively, special grades of

low moisture content ingredients may be used. The use of vacuum processing at

elevated temperatures serves two key purposes; it prevents the take up of

moisture during processing and facilitates the removal of any unwanted water

residues introduced with the raw materials. With moisture cured methoxysilane

based sealants, we strongly recommend that all additives be quickly dispersed

and not allowed to remain in direct contact with the resin component.

Prolonged contact may sometimes result in the formation of an insoluble fine

skin which later appears as small particles in the final sealant.

Storage temperature:

It should be stored in the original containers in a dry place at temperatures

between 5℃ (41℉) and 30℃ (86℉). Avoid exposure to direct sunlight or frost.

In these conditions, this product should be used within 48 months from

production..

Precautions:

Avoid direct contact with sunlight.

For additional safety information please see the Safety Data Sheet。

The information described in the above documents is based on data from our experimental center and related literature; we do not assume corresponding legal liability. Our ordinary standards impose only limited obligations. Consistent with local laws and regulations, our company assumes no responsibility for the handling, processing or use of this product.