Products information:

PAMID D670 is a new high performance micronised amide wax rheology modifier offering very good recoatability for ambient curing solvent-based epoxy coatings.

It has been designed to overcome those difficulties which exist with older type organo-wax rheology modifiers e.g. seeding, false-body and migration of readily dissolved species to the surface. Consequently, when used in strong solvent systems, coatings formulated using PAMID D670 offer an enhanced performance and very good recoatability.

The performance benefits of this product are:

1.100% Active

2.Imparts shear thinning rheology with thixotropic viscosity recovery

3.Very good recoatability

4.Excellent sag resistance

5.Very good anti-settle properties

6.Good storage stability

Technical data:

Particle size distribution:(Malvern Mastersizer S laser particle size analyser)

DV.1 min. 1.8 μm

DV.9 max. 15.0 μm

Appearance ：White powder             Capillary Melting Point ： 120-130°C

Density at 25°C , g/cm3： 0.98          Bulk density, g/cm3 0.4-0.6

Applications:

It has been designed to overcome those difficulties which exist with older type organo-wax rheology modifiers e.g. seeding, false-body and migration of readily dissolved species to the surface. Consequently, when used in strong solvent systems, coatings formulated using PAMID D670 offer an enhanced performance and very good recoatability.

Recommended Amounts :  

Anti-Settling and Sag Resistance 0.5 - 1.5%

Incorporation Methods And Processing Instructions:

The use of high-speed dispersers is ideal for the incorporation and activation of PAMID D670 in that they develop both the necessary level of shear and temperature. PAMID D670 is best added along with the initial charge of resin during the pigment dispersion and grind stage. Efficient activation will be achieved by allowing the temperature during dispersion to rise to 45 - 65°C (113 - 149°F), but more preferably from 55 - 65°C (131 -149°F), and maintaining this condition of dispersion and temperature for 20 - 30 minutes.The

activation process constitutes the conversion of the PAMID D670 particles to an interacting network of fibre-like particles. It is this network that gives rise to the final coating’s shear thinning rheology.

This shear thinning characteristic provides a very high viscosity under the low shear rates associated with sedimentation, and a low viscosity at the much higher application shear rates. The net result is excellent control of sedimentation combined with ease of application. Immediately following application, where low shear conditions again predominate, the coating’s viscosity undergoes a time dependent recovery as the network re-establishes itself. This time dependence is known as thixotropy and enables the final coating to attain very good levelling and sag resistance. Due to the multitude of formulations, processing methods and application conditions used in the field, we strongly recommend that all products containing PAMID D670 be tested thoroughly to ensure their suitability for their intended end use. In particular, application in poorly

ventilated areas, or on hot substrates, or by hot spray, may require additional attention.

Precautions For Storage:

PAMID D670 should be stored in the original containers in a dry place at temperatures between 5°C and 30°C. Avoid exposure to direct sunlight or frost. Under these conditions the product may be stored for up to 2 years from production date.

Precautions For Use:

Please refer to the corresponding Safety Data Sheet.

The information described in the above documents is based on data from our experimental center and related literature; we do not assume corresponding legal liability. Our ordinary standards impose only limited obligations. Consistent with local laws and regulations, our company assumes no responsibility for the handling, processing or use of this product.