Application system:

PAMID D660 is a strong thixotropic agent based on a polyamide wax and recommended for non-solvent as well as non-polar systems. Unlike hydrogenated castor wax products, PAMID D660 permits incorporation at higher temperatures and functions as a strong anti-slumping agent without seeding.

The performance benefits of this product are:

1.Excellent sag resistance

2.Thixotropy with good heat resistance and stability on ageing.

3.100% Active ，Excellent cost/performance

4.Imparts shear thinning rheology with thixotropic viscosity recovery

5.Very good anti-settle properties

6.without seeding problem on high speed grinding at higher temperature

Technical data:

Appearance： White powder

Particle size distribution( laser particle size analyser):       DV.1 min. 1.0 μm    DV.9 max. 15.0 μm

Bulk density, g/cm3 ：0.4-0.6            Density at 25°C , g/cm3 ： 0.98

Melting Point ： 123-126°C            Acid Value ，mg KOH/g : < 8

Applications:

It has been designed to overcome those difficulties which exist with older type organo-wax rheology modifiers e.g. seeding, false-body and migration of readily dissolved species to the surface. PAMID D660 can sometimes cause poor recoatability or intercoat adhesion when this products is used in paint and coatings. Therefore, thorough preliminary test is absolute. ( In strong solvents systems ,such as xylene blended with alcohols , glycol ethers or esters, we recommend use our PAMID D650 or PAMID D670 ) .

Recommended Amounts :  

Anti-Settling and Sag Resistance 0.5 - 1.5%

Incorporation Methods And Processing Instructions:

The use of high-speed dispersers is ideal for the incorporation and activation of PAMID D660 in that they develop both the necessary level of shear and temperature. PAMID D660 is best added along with the initial charge of resin during the pigment dispersion and grind stage. Efficient activation will be achieved by allowing the temperature during dispersion, and maintaining this condition of dispersion and temperature for 20 - 30 minutes .

Solvent-Free 55 - 65°C ；

Dearomatised mineral spirits 55 - 60°C ；Mineral spirits 50 - 55°C ；

Aromatic hydrocarbons ;Aromatic hydrocarbon/ Alcohol blends / 40 - 50°C ；

Aromatic hydrocarbon/ Glycol ether blends：40 - 50°C

Aromatic hydrocarbons/ Ester blends： 40 - 50°C

The activation process constitutes the conversion of the PAMID D660 particles to an interacting network of fibre-like particles. It is this network that gives rise to the final coating’s shear thinning rheology. This shear thinning characteristic provides a very high viscosity under the low shear rates associated with sedimentation, and a low viscosity at the much higher application shear rates. The net result is excellent control of sedimentation combined with ease of application. Immediately following application, where low shear conditions again predominate, the coating ’ s viscosity undergoes a time dependent recovery as the network re-establishes itself. This time dependence is known as thixotropy and enables the final coating to attain very good levelling and sag resistance. Due to the multitude of formulations, processing methods and application conditions used in the field, we strongly recommend that all products containing PAMID D660 betested thoroughly to ensure their suitability for their intended end use. In particular, application in poorly ventilated areas, or on hot substrates, or by hot spray, may require additional attention.

Precautions For Storage:

PAMID D660 should be stored in the original containers in a dry place at temperatures between 5°C and 30°C . Avoid exposure to direct sunlight or frost. Under these conditions the product may be stored for up to 2 years from production date.

Precautions For Use:

Please refer to the corresponding Safety Data Sheet.

The information described in the above documents is based on data from our experimental center and related literature; we do not assume corresponding legal liability. Our ordinary standards impose only limited obligations. Consistent with local laws and regulations, our company assumes no responsibility for the handling, processing or use of this product.