Application system:

Apply to Assembly, Other Adhesives, Selalants

Gunnability, Slump resistance, Temperature resistance ,APEO Free, Heavy Metal Free, Solvent Free, Not intentionally added but not specifically

measured (not part of product specification）

Features:

PAMID D620 is a high performance micronised amide wax rheology

modifier designed for the low temperature manufacture of moisture curing

methoxysilane systems, where processing temperatures typically lie within the

range 60-90℃.PAMID D620 particles are converted to an interacting

network of crystalline fibres. It is this network that gives rise to the shear

thinning rheology. This shear thinning characteristic provides for a low viscosity

at the shear rates associated with application by extrusion, and a very high

viscosity under the low shear rates experienced after application. The net result

is ease of application followed by excellent sag and slump resistance.

Specific performance:

1. Easy handling
2. Antisettling.
3. In-can appearence
4. Syneresis resistance
5. Viscosity stability

Physical properties:

Nature: Polyamide

Appearance:Off-white micronized powder

Solid Content (%):100

Active Content (%)：100

Specific gravity：0.99

Particle size distribution：DV.1 min: 1.8 μm / DV.9 max: 15.0 μm

Bulk density：0.4-0.6

Melting Point(℃)：128

Bio content (%)：93

Recommended addition level:  

1-5% under heat and shear

How to use:

The activation process constitutes the conversion of the CRAYVALLAC* SLX

particles to an interacting network of crystalline fibres. It is this network that

gives rise to the shear thinning rheology. This shear thinning characteristic

provides for a low viscosity at the shear rates associated with application by

extrusion, and a very high viscosity under the low shear rates experienced after

application. The net result is ease of application followed by excellent sag and

slump resistance.Activation at too low a temperature, or for too short a time,

will result in the formation of an inefficient interacting network and

The successful manufacture of methoxysilane based sealants is very dependent

consequently poor sag and slump resistance.

on the careful control of moisture levels throughout manufacture and storage.

For this reason it is normal practice to pre-dry all pigments and extenders prior

to dispersion with the methoxysilane polymer. Alternatively, special grades of

low moisture content ingredients may be used. The use of vacuum processing is

essentially there to prevent the take up of moisture during processing.Due to

the lower processing temperature used, the vacuum processing is not

particularly efficient at removing unwanted water residues introduced with the

raw materials. Therefore a greater emphasis must be put on the pre-drying of

pigments and extenders, or the purchase of special grades of low moisture

content raw materials.

With moisture cured methoxysilane based se alants, we strongly recommend

that all additives be quickly dispersed and not allowed to remain in direct

contact with the resin component.Prolonged contact may sometimes result in

the formation of an insoluble fine skin which later appears as small particles in

the final sealant.

Storage temperature:

It should be stored in the original containers in a dry place at temperatures

between 5℃ (41℉) and 30℃ (86℉). Avoid exposure to direct sunlight or frost.

In these conditions, this product should be used within 48 months from

production..

Precautions:

Avoid direct contact with sunlight.

For additional safety information please see the Safety Data Sheet。

The information described in the above documents is based on data from our experimental center and related literature; we do not assume corresponding legal liability. Our ordinary standards impose only limited obligations. Consistent with local laws and regulations, our company assumes no responsibility for the handling, processing or use of this product.